SoC, SiP: Difference between revisions
Jump to navigation
Jump to search
mNo edit summary |
mNo edit summary |
||
Line 1: | Line 1: | ||
{{#addbodyclass:tag_tech}} | {{#addbodyclass:tag_tech}} | ||
<!-- | <!-- | ||
IC = Integrated Circuit | '''IC = Integrated Circuit''' | ||
: ...a functional whole etched into a single piece of silicon | : ...a functional whole etched into a single piece of silicon | ||
: ICs started out fairly simple which | : ICs started out fairly simple which | ||
Line 7: | Line 7: | ||
SiP = System-in-Package, means bundling multiple ICs in a single package | '''SiP = System-in-Package''', means bundling multiple ICs in a single package | ||
: and may literally be the separate ICs, e.g. putting an existing CPU and some existing DRAM in the same IC | : and may literally be the separate ICs, e.g. putting an existing CPU and some existing DRAM in the same IC | ||
: may be as separate silicon dies, with some interconnects to make them work | : may be as separate silicon dies, with some interconnects to make them work | ||
Line 14: | Line 14: | ||
SoC = System-on-Chip | '''SoC = System-on-Chip''' | ||
: multiple functions integrated tightly | : multiple functions integrated tightly | ||
: and part of the same die/substrate | : and part of the same die/substrate |
Latest revision as of 13:51, 10 May 2024