SoC, SiP: Difference between revisions
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{{#addbodyclass:tag_tech}} | {{#addbodyclass:tag_tech}} | ||
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IC = Integrated Circuit | '''IC = Integrated Circuit''' | ||
: ...a functional whole etched into a single piece of silicon | : ...a functional whole etched into a single piece of silicon | ||
: ICs started out fairly simple which | : ICs started out fairly simple which | ||
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SiP = System-in-Package, means bundling multiple ICs in a single package | '''SiP = System-in-Package''', means bundling multiple ICs in a single package | ||
: and may literally be the separate ICs, e.g. putting an existing CPU and some existing DRAM in the same IC | : and may literally be the separate ICs, e.g. putting an existing CPU and some existing DRAM in the same IC | ||
: may be as separate silicon dies, with some interconnects to make them work | : may be as separate silicon dies, with some interconnects to make them work | ||
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SoC = System-on-Chip | '''SoC = System-on-Chip''' | ||
: multiple functions integrated tightly | : multiple functions integrated tightly | ||
: and part of the same die/substrate | : and part of the same die/substrate | ||
Latest revision as of 13:51, 10 May 2024